Solder Paste Analyzer
SPA 1000 Solder Paste Analyzer
The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 test system used to characterize solder paste in compliance with both IPC and IEC Standards.
The SPA 1000 also introduced new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It accomplishes this by determining the “Open-Time” for the paste. It also performs the Slump Test and both methods provide a “Go/No-Go” result in less than 30-minutes to ensure minimum delay for production.
The SPA 1000 provides fast and accurate testing to help control and manage solder paste in the production process. It helps to reduce defects such as: missing components, tombstoning, component misalignment, non-wetting etc., thereby greatly reducing inspection and rework time and cost – and increasing profit. These issues have become even more relevant since the introduction of lead-free processes and smaller components.
New International standards have been introduced to measure essential solder paste conditions that, when properly measured, will